Introduction
Glue overflow in Flexible Printed Circuit (FPC) manufacturing occurs when the adhesive from the overlay flows out during the lamination process, leading to undesirable glue stains on the FPC pads. This issue is often triggered by the rise in temperature during lamination, causing the adhesive to become more fluid. Several factors contribute to glue overflow, and it is...
Introduction
With the rapid evolution of electronic products, particularly in consumer electronics like smartphones, tablets, and wearable devices, the application of Flexible Printed Circuits (FPC) has become increasingly prevalent. This document explores the characteristics, production processes, and applications of FPCs, with a focus on the integration of FPCs and rigid PCBs to form...
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