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Tan Longhua added blog 기타
2024-08-08 07:03:08 - 번역

Managing Glue Overflow in Flexible Printed Circuit Manufacturing
Introduction Glue overflow in Flexible Printed Circuit (FPC) manufacturing occurs when the adhesive from the overlay flows out during the lamination process, leading to undesirable glue stains on the FPC pads. This issue is often triggered by the rise in temperature during lamination, causing the adhesive to become more fluid. Several factors contribute to glue overflow, and it is...

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Tan Longhua added blog 기타
2024-10-09 09:31:34 - 번역

Materials Used in Flexible Printed Circuit Boards (FPC)
Materials Used in Flexible Printed Circuit Boards (FPC) Flexible printed circuit boards (FPCs) have become crucial in various industries due to their versatility, light weight, and ability to fit complex designs. The choice of materials for flexible circuit boards significantly impacts their performance, durability, and cost. In this article, we’ll explore the key materials used in...

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